Centrosarm Vacuum Solder Reflow Oven
This is a batch-type vacuum reflow furnace compatible with voidless and fluxless reflow. We offer a variety of lineups that support everything from development to mass production.
In conventional atmospheric reflow, there are approximately 20% void areas remaining in the solder, which leads to a deterioration in joint strength. The batch-type vacuum reflow furnace "c.VACUNITE series" from Centrolsam (Germany) can reduce the void areas to less than 2% by using vacuum. Additionally, it can accommodate fluxless reflow by using 100% hydrogen or reducing effect gases such as formic acid. As an option, it also supports plasma cleaning of the bonding surface using MW plasma.
- Company：伯東 本社
- Price：Other
